| 发明名称 |
Working Method of Metal Material and Semiconductor Apparatus Fabricated by the Method |
| 摘要 |
A method comprising constraining a circumference of a blank of a Cu-Mo alloy and one of surfaces to be worked with the use of a die, and using a working punch or a counter punch to apply working pressures to the other of the surfaces to be worked, thereby obtaining a cup-shaped body.
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| 申请公布号 |
US2008179732(A1) |
申请公布日期 |
2008.07.31 |
| 申请号 |
US20070928832 |
申请日期 |
2007.10.30 |
| 申请人 |
HITACHI LTD. |
发明人 |
KOBAYASHI MASAYUKI;HARADA KOUJI;TOKUDA HIROATSU;OJIMA KAZUO |
| 分类号 |
H01L23/04;H01L21/48;H01L25/07 |
主分类号 |
H01L23/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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