| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laminated mounting structure where a yield is improved, costs are reduced, and manufacturing time is reduced by reducing size, connection resistance, and the number of manufacturing processes. <P>SOLUTION: The laminated mounting structure has: a first substrate 101a, a second substrate 101b, and an intermediate substrate 103; a conductive member 105 arranged at a gap between connection terminals 104a, 104b formed on the substrates 101a, 101b; a bump electrode 201 formed on the connection terminals 104a, 104b; and a through hole 106 formed on the intermediate substrate 103. The bump electrode 201 is brought into contact with the conductive member 105 at least at the through hole 106 by joining the substrates 101a, 101b using a junction section 120, and the connection terminals 104a, 104b of the substrates 101a, 101b are connected electrically. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
