| 摘要 |
PROBLEM TO BE SOLVED: To suppress throughput deterioration by reducing parasitic capacity. SOLUTION: In this sheet with a communication function provided with a signal transmission substrate for transmitting a signal, and a plurality of communication chips scattered on the signal transmission substrate to perform signal transmission by a two-dimensional spread signal transmission technology on the signal transmission substrate, the signal transmission substrate is configured by laminating at least a conductive layer for transmitting a signal between communication chips, a ground layer for grounding the communication chips and an insulation layer for mutually insulating the conductive layer and the ground layer, and the conductive layer is configured so as to connect respective adjacent communication chips by the plurality of linear conduction paths insulated from each other. COPYRIGHT: (C)2008,JPO&INPIT
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