| 摘要 |
The present invention relates to a clamping device for compression clamping of one or more semiconductor devices and associated semiconductor components with a desired compression force equally distributed across the opposing surfaces of the devices and associated components. The semiconductor devices and components are located between opposing jaws that are joined together by at least two tie rods, which compressively load the opposing jaws to apply the desired compression force to the semiconductor devices and components. The desired compression force is first achieved in even distribution between independent clamp pressure set point assemblies and the first jaw, where each of the independent clamp pressure set point assemblies is associated with one of the tie rods. Upon final assembly of the clamping device the desired pressure force is achieved across the semiconductor devices and components by compression of the opposing jaws between the one or more semiconductor devices and associated semiconductor components until the clamp pressure indicator elements associated with each of the clamp pressure set point assemblies indicates the desired compression force has been applied. |
