BONDING PAD FOR SEMICONDUCTOR INTEGRATED CIRCUIT, MANUFACTURING METHOD FOR THE BONDING PAD, SEMICONDUCTOR INTEGRATED CIRCUIT, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a highly reliable bonding pad for a semiconductor integrated circuit which ensures the flatness of the surface of the pad, allows conduction of a sufficient amount of current, and shows less conduction failure on an opening path interconnecting metal wiring layers.

SOLUTION: The bonding pad 10 for the semiconductor integrated circuit includes the opening path P interconnecting the metal wiring layers. The opening path P is composed of a latticed pattern of opening portions having at least two different opening widths consisting of one opening width necessary for filling the opening path and another opening width larger than one opening width.

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