| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thin type solid-state image pickup device which has a high cooling effect. <P>SOLUTION: The solid-state image pickup device has an image sensor 115, a heat conduction member 119 provided on the rear side of an imaging surface of the image sensor 115, an electronic cooling element 120 which contacts to the heat conduction member 119 and is provided on a side to the imaging surface of the image sensor 115, and a heat release member (a camera bottom 121) that contacts to the electronic cooling element 120. <P>COPYRIGHT: (C)2008,JPO&INPIT |
