| 摘要 |
A multilayer wiring board (1) provided in a camera module has a sandwiched wiring layer (13) between opened wiring layers (11) having openings (12). The openings (12) formed on the opened wiring layers (11) form a through hole (12a) which penetrates the opened wiring layers (11) in the stacking direction. The sandwiched wiring layer (13) overlaps at least a part of the openings (12) of the opened wiring layers (11) and has a blocking section (13a) which blocks the through hole (12a) in the middle. Therefore, thermal stress applied on the multilayer wiring board is modified, while maintaining degrees of freedom in wiring design.
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