| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce an effect on a mother board by a resin layer. <P>SOLUTION: A semiconductor device includes: a semiconductor substrate 10 having an electrode 14 electrically connected to an integrated circuit 12; a first resin layer 18 formed on a surface where the electrode 14 of the semiconductor substrate 10 is formed; wiring 20 that is electrically connected to the electrode 14 and is formed on the first resin layer 18; a metal layer 22 formed on the first resin layer 18; and a second resin layer 24. On the second resin layer 24, a first through hole 26 overlapping with the wiring 20 and a second through hole 28 for exposing a metal layer 22 partially are formed. An external terminal 32 is provided on the wiring 20 in the first through hole 26. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
