| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device wherein wafer test is conducted to automatically judge whether or not a measured chip has a statistically unexpected value and also judge whether or not measurement is conducted again or that the chip is defective. SOLUTION: The method of manufacturing a semiconductor device includes a step to form a plurality of chips on a wafer; a step to conduct testing for the chips in terms of the specified test items; a step to prepare a histogram that shows the number of chips for each of test items; a step to find out a range of the values of the test items as a non-defective area wherein the histogram becomes most approximate to a normal distribution; and a step to judge whether or not chips not corresponding to the non-defective area are measured again or that they are defective. COPYRIGHT: (C)2008,JPO&INPIT
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