| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg capable of efficiently suppressing radiation noise from a printed board having electronic components mounted thereon and electromagnetic interference generated in the board, and easily ensuring insulating characteristics between layers in a multilayer substrate, and to provide a printed circuit board using the prepreg. SOLUTION: A ferrite plating layer 2 is formed on the surface of a warp-and weft-knitted glass cloth 1, and the layer 2 is coated with an insulating resin layer 3 such as epoxy to form a prepreg 4. After forming the ferrite plating layer 2, the epoxy resin, etc., is impregnated into the glass cloth, thereby obtaining the prepreg 4. In this case, the thickness of the ferrite plating film should be about 0.5μm in order to obtain a noise suppressing effect, and it is preferably not more than 10μm in consideration of the thickness of the glass cloth and the practical thickness of the prepreg. COPYRIGHT: (C)2008,JPO&INPIT
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