| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a UV irradiation device capable of performing both the deterioration of adhesion in a UV tape and the dissolution and removal of an organic matter on the surface of a semiconductor by the use of one and the same UV irradiation device, reducing processes, and reducing a manufacturing cost. <P>SOLUTION: Functions for radiating UV light are provided at both end sides of the UV tape with semiconductor chips adhered thereto. The semiconductor chip 1 is adhered to the UV tape 2 held by a ring 3. The ring 3 is fixed to a stage 4 in a treatment chamber 6 of the UV irradiation device. Two UV light sources 5 are placed at both sides of the stage 4. The UV light is radiated to each side of the UV tape, i.e., the side with the semiconductor chip adhered thereto and the opposite side. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
