发明名称 |
METHOD AND APPARATUS FOR MEASURING SHAPE OF HEAT TREATMENT JIG |
摘要 |
A method for measuring the shape of a heating treatment jig to be held by a holding portion of a vertical heat treatment apparatus includes measuring the shape of the heat treatment jig in a state that the position of a supporting portion for supporting the heat treatment jig is set to be the same as the position of the holding portion for the heat treatment jig in the vertical heat treatment apparatus. The heat treatment jig can be used for placing a semiconductor wafer to be subjected to heat treatment.
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申请公布号 |
US2008178685(A1) |
申请公布日期 |
2008.07.31 |
申请号 |
US20080020974 |
申请日期 |
2008.01.28 |
申请人 |
ASAHI GLASS COMPANY, LIMITED |
发明人 |
MISHIRO HITOSHI;NAKAMURA ATSUSHI |
分类号 |
G01N3/02;G01B3/00;G01N3/04 |
主分类号 |
G01N3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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