PROCESS FOR PRODUCTION OF MULTILAYER PRINTED WIRING BOARDS

摘要

The invention provides a process for the production of multilayer printed wiring boards which makes it possible to form an interlayer dielectric film which is reduced in the surface roughness brought about by surface roughening for preparing a substrate surface suitable for plating and which permits complete removal of smear in desmearing treatment conducted simultaneously with the surface roughening; and an adhesive film to be used in the process. An adhesive film to be laminated with a base material for circuit board and thus used as an interlayer dielectric film of a multilayer printed wiring board, which film is composed of a support and a substrate layer made of the first curable resin composition and an adhesive layer made of the second curable resin composition which are formed on the support in this order, wherein the first curable resin composition is a composition which exhibits a mass loss due to roughening of less than 3% by mass when a layer (of 40µm in thickness) of the composition is subjected to the same curing and roughening treatment as that employed in the production of a multilayer printed wiring board and the second curable resin composition is a composition which exhibits a mass loss due to roughening of 3 to 10% by mass when a layer (of 40µm in thickness) of the composition is subjected to the same curing and roughening treatment as that employed in the production of a multilayer printed wiring board, with the proviso that all the following requirements are satisfied: 10µm = X+Y = 100µm, 1µm < X, and 1µm < Y (wherein X is thickness (µm) of the substrate layer and Y is thickness (µm) of the adhesive layer).