HIGH TEMPERATURE SOLDER MATERIALS

摘要

A solder material is formed utilizing a transient liquid phase sintering process, where a precursor material is first formed. The precursor material comprises a plurality of metal particles including a first metal having a fi rst melting point temperature and a second metal having a second melting poi nt temperature, the first melting point temperature being greater than the s econd melting point temperature. The precursor material is heated to a proce ss temperature (Tp) that is greater than the second melting point temperatur e and less than the first melting point temperature, and the precursor mater ial is isothermally held at the process temperature (Tp) for a preselected h olding period so as to form a metal alloy material having a melting point te mperature that is greater than the process temperature. The solder material can be used to bond two components together in a device specified for use at an application temperature (Ta), where Ta/Tp > 1.