| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and apparatus for processing a substrate capable of preferably drying the substrate surface at low cost when drying a substrate surface wet with a processing liquid. SOLUTION: Rinse liquid adhered on the substrate surface Wf is substituted by the liquid mixture by supplying a liquid mixture (IPA+DIW) to the substrate surface Wf after a rinsing process. Thereby, the rinse liquid adhered in a gap between patterns FP formed on the substrate surface Wf is substituted by the liquid mixture. Subsequently, a paddle-like liquid layer 21 of DIW is formed on the substrate surface Wf by supplying DIW from a mist supply nozzle 9 as a mist to the substrate surface Wf. Thereby, the liquid mixture in the surface layer portion is removed from the substrate surface Wf in a state with the liquid mixture entered inside the gap of the patterns FP substantially remaining. Thereafter, the liquid layer 21 is removed from the substrate surface Wf for drying the substrate surface Wf. COPYRIGHT: (C)2008,JPO&INPIT
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