| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate which is low in dielectric loss tangent, low in effects of temperature and humidity on the dielectric loss tangent and unlikely to cause peeling by the occurrence of a blister or the like; and to provide an electric circuit board including the laminate. SOLUTION: The laminate is obtained by a process which flow casts a polymerizable composition on a support and subjects it to bulk metathesis polymerization to obtain a film-like molding, laminates a conductive wiring layer on the surface of the molding by plating etc., and subsequently laminates an amorphous carbon film on the wiring layer; wherein the polymerizable composition contains a cycloolefin monomer, a metathesis polymerization catalyst, a chain transfer agent and a crosslinking agent. The electric circuit board is obtained by superposing a number of the laminates one upon another. COPYRIGHT: (C)2008,JPO&INPIT
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