| 发明名称 |
Electronic and optical circuit integration through wafer bonding |
| 摘要 |
One embodiment in accordance with the invention is an apparatus that can include an optical circuit wafer and an integrated circuit wafer. The optical circuit wafer and the integrated circuit wafer are bonded together by a wafer bonding process.
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| 申请公布号 |
US2008181558(A1) |
申请公布日期 |
2008.07.31 |
| 申请号 |
US20070701314 |
申请日期 |
2007.01.31 |
| 申请人 |
HARTWELL PETER G;BEAUSOLEIL RAYMOND;WILLIAMS R STANLEY;STEWART DUNCAN |
发明人 |
HARTWELL PETER G.;BEAUSOLEIL RAYMOND;WILLIAMS R. STANLEY;STEWART DUNCAN |
| 分类号 |
G02B6/12;H01L21/30 |
主分类号 |
G02B6/12 |
| 代理机构 |
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