发明名称 MODULAR CHASSIS PROVIDING SCALABLE MECHANICAL, ELECTRICAL AND ENVIRONMENTAL FUNCTIONALITY FOR MICROTCA AND ADVANCED TCA BOARDS
摘要 A modular chassis arrangement for electronic modules that is configurable into a mechanically and electrically interconnected structure capable of delivering scalable mechanical, electrical and environmental functionality for a multiplicity of electronic modules. In one embodiment, the electronic modules are compliant with AdvancedTCA or MicroTCA standards in a modular Pico-Shelf configuration that support stackable and/or back-to-back multiple unit chassis.
申请公布号 WO2007112109(A3) 申请公布日期 2008.07.31
申请号 WO2007US07490 申请日期 2007.03.26
申请人 SLT LOGIC LLC;SHARMA, VISWA;CHU, WILLIAM;JAMES, ALLEN, D.;TSENG, MING, SIU;SCHLEGEL, NEIL;LENTZ, DAVID, B.;SONNEK, CHRISTOPHER, D. 发明人 SHARMA, VISWA;CHU, WILLIAM;JAMES, ALLEN, D.;TSENG, MING, SIU;SCHLEGEL, NEIL;LENTZ, DAVID, B.;SONNEK, CHRISTOPHER, D.
分类号 H05K7/14 主分类号 H05K7/14
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