发明名称 |
ELASTOMER MODIFIED CHEMICAL MECHANICAL POLISHING PAD |
摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a chemical mechanical polishing pad suitable for polishing at least one of optical and magnetic base material. <P>SOLUTION: A polishing pad includes a polymer matrix, with elastomeric polymers dispersed therein. The polymer matrix has a glass transition temperature exceeding a room temperature, and the elastomeric polymer has an average length of at least 0.1 μm in at least one direction, constituting 1 to 45 vol.% of the polishing pad, and has the glass transition temperature of less than the room temperature. The polishing pad has a diamond conditioner cutting rate which is increased compared to the polishing pad formed from the polymeric matrix without elastomeric polymer. <P>COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2008173760(A) |
申请公布日期 |
2008.07.31 |
申请号 |
JP20070329820 |
申请日期 |
2007.12.21 |
申请人 |
ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC |
发明人 |
KULP MARY JO;JAMES DAVID B;CRUZ CARLOS A |
分类号 |
B24B37/00;B24D99/00;C08G18/04;C08J5/14;C08L9/00;C08L75/04;H01L21/304 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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