| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To support a substrate while flattening the substrate in a substrate supporting device, a surface potential measuring device equipped with the substrate supporting device, a film thickness measuring device and a substrate inspection apparatus. <P>SOLUTION: In the substrate supporting device 2 of a surface potential measuring device 1, first fluid is jetted from the first annular porous member 211 of a first fluid jetting section 21 toward the periphery of an object region 911 on the upper surface 91 of a substrate 9, and second fluid is jetted from the second annular porous member 221 of a second fluid jetting section 22 opposing the first fluid jetting section 21 with the substrate 9 sandwiched toward the lower surface 92 of the substrate 9. Consequently, the substrate 9 can be supported while being flattened between the first fluid jetting section 21 and the second fluid jetting section 22. Furthermore, a distance between the substrate 9 and the first annular porous member 211 of the first fluid jetting section 21 can be kept constant with a simple structure. As a result, a probe 31 can be positioned on the flattened object region 911 at a desired interval and the surface potential can be measured with high precision for the object region 911 on the substrate 9 with the surface potential measuring device 1. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
