| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate which comprises a ceramic layer having a surface for mounting a light emitting element capable of efficiently radiating the heat of the light emitting element, and freely forming a requited wiring layer therein, and can be manufactured by a simple and small number of processes. SOLUTION: A wiring substrate 1a comprises a ceramic layer s1 (s11-s13) comprising a surface 6 for mounting a light emitting diode (light emitting element) 18 and containing metal components such as W or Mo, pads (conductor) 8a and 9a which are formed in an area not smaller than two thirds or more the mounting surface 6 with a surface layer covered with at least one of an Ag plating film 12 and an Au plating film 13, and a ceramic layer s21 which is stacked on the mounting surface 6 (upper layer) side of the ceramic layer s1 containing the metal component with a cavity 5a composed of the mounting surface 6 and a side surface 7a rising obliquely from the peripheral side of the mounting surface 6 formed. Its whiteness is higher than the ceramic layer s1 containing the metal component. COPYRIGHT: (C)2008,JPO&INPIT
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