发明名称 LIGHT-EMITTING ELEMENT AND ITS FABRICATION PROCESS, LIGHT-EMITTING ELEMENT ASSEMBLY AND ITS FABRICATION PROCESS
摘要 PROBLEM TO BE SOLVED: To provide a process for fabricating a light-emitting element in which the width of a current constriction region can be controlled when the current constriction region is formed based on an easy method. SOLUTION: The process for fabricating a light-emitting element comprises a step (A) for forming a first compound semiconductor layer 20 having a first conductivity type, an active later 30, and a second compound semiconductor layer 40 having a second conductivity type sequentially on a substrate 10, a step (B) for forming a plurality of spot holes 50 in the thickness direction at least in the region of the second compound semiconductor layer 40 located on the outside of a region for forming a current constriction region 44, and a step (C) for forming an insulating region 43 by performing insulation processing from the sidewall of the hole 50 for a part of the second compound semiconductor layer 40, thus obtaining a current constriction region 44 surrounded by the insulating region 43 in the second compound semiconductor layer 40. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008177430(A) 申请公布日期 2008.07.31
申请号 JP20070010580 申请日期 2007.01.19
申请人 SONY CORP 发明人 MASUI TAKESHI;ARAKIDA TAKAHIRO;KODA RINTARO;OKI TOMOYUKI
分类号 H01S5/183 主分类号 H01S5/183
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