| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device TAB tape carrier which has an evenly high bump whose upper surface is flat and whose width is not widened in the width direction of the wiring and in the pitch direction between the bumps, suppresses or eliminates the generation of defect in juncture with the semiconductor device and the generation of defect in short-circuiting of bumps, and copes with fine pitching, and also to provide a method for manufacturing the same. SOLUTION: A pattern of the wiring 2 is formed by performing pattern processing on a conductive foil or a conductive plate like a copper foil 11 in etching process, a pattern of the bump 5 is also formed, and half etching is performed on the pattern 14 of the wiring 2 to thin the wiring 2 further than the bump 5, thereby relatively thickening the bump 5 further than the wiring 2. COPYRIGHT: (C)2008,JPO&INPIT
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