发明名称 VARIANT CASE FOR HOUSING ELECTRONIC COMPONENT, AND RESIN-MOLDED ELECTRONIC DEVICE USING THE CASE
摘要 PROBLEM TO BE SOLVED: To make a variant case stand erect that has the thickness of the end part of the opposite side of the opening part thinner than that of the other part for housing an electronic component, with the opening part of the case facing upward, without having to provide a special holder when a resin is injected. SOLUTION: The outer surfaces of the wall parts 10a, 10b facing in the thickness direction at the thickest part of the case 10 are formed smoothly, a first engaging part 11 is provided on one outer surface of the two wall parts 10a, 10b; and a second engaging part 12 capable of engaging, with an engaging part having the same shape and the same size as the first engaging part 11 being provided on the other outer surface so that the respective positions correspond. Engagement of the first engaging part 11 and the second engaging part 12 mutually adjacent to a plurality of lined cases 10 couples the plurality of cases to structure an aggregation 13 of the case having a self-supporting capability. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008177354(A) 申请公布日期 2008.07.31
申请号 JP20070009348 申请日期 2007.01.18
申请人 KOKUSAN DENKI CO LTD 发明人 YAGISHITA WATARU;SASAKI KOJI
分类号 H05K5/00;B60R16/02 主分类号 H05K5/00
代理机构 代理人
主权项
地址