| 摘要 |
PROBLEM TO BE SOLVED: To provide a compound semiconductor wafer including a notch at the external circumferential part thereof and allowing identification of the surface and backside. SOLUTION: The compound semiconductor wafer includes the notch 3 for identifying orientation at the external circumferential part thereof and also includes a chamfered part 14 at the external circumferential part of both surfaces 15, 16 of the wafer. Grinding traces 17, 18 that are different in the grinding direction are formed on the chamfered part 14 of both surfaces 15, 16 of the wafer. COPYRIGHT: (C)2008,JPO&INPIT
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