| 摘要 |
A vacuum suction cylinder for transferring a semiconductor chip is provided to absorb impact applied to the semiconductor chip by moving a rod of a vacuum absorbing cylinder finely. A first main body(102) includes a cavity(100). A first rod(106) having a cavity is inserted into the cavity of the first main body. A first anti-vibration member(108) prevents the vibration of the first rod. A first piston(110) is inserted into the upper part of the first main body and fixed to the upper part of the first rod. A vertical air injection hole(112) is formed at one side of the first main body. A horizontal air injection hole(114) is formed on the upper part of the first main body. A stopper(116) is formed to close an end of the horizontal air injection hole. A first bushing(118) is formed to prevent the vibration of the first rod. A first spring(120) provides elastic force to the first piston. A second main body(202) has a cavity(200). A second rod(206) has a vacuum absorbing pad. A connective part(208) covers the outer periphery of the second rod. A second spring(210) moves the second rod. A second anti-vibration member(212) prevents the vibration of the connective part. A second piston(214) is formed to move the second rod. A second bushing(218) prevents the vibration of the second rod. A fourth spring(220) provides the elastic force to the second piston. A ball state prevents the rotation of the second rod. A third bushing(224) prevents the vibration of the second rod.
|
