| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique by which a semiconductor chip provided with a first pad is tested without increasing an unnecessary terminal. <P>SOLUTION: The method includes: a temporary bonding step of electrically connecting a first pad provided at a first semiconductor chip to the outside through at least a temporary bonding wire; a testing step of following the temporary bonding step and testing the first semiconductor chip by inputting/outputting an electric signal to/from the first pad from the outside through the temporary bonding wire; a temporary bonding release step of removing the temporary bonding wire; and a sealing step of following the temporary bonding release step and sealing the first semiconductor chip so that at least the first pad may be covered. <P>COPYRIGHT: (C)2008,JPO&INPIT |
