| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board assembly which can reduce electromagnetic wave leaked from an opening prepared for memory replacement, casing for an information technology device, and an information technology device. <P>SOLUTION: The printed circuit board assembly is mounted on a printed circuit board 16, and has connectors 14A, 14B to which memory modules 10A, 10B are connected and electric wave absorption sheets 34A, 34B prepared in a connector. The electric wave absorption sheet is attached so as to cover a side surface of the connector facing thereto. A casing 38 has an opening 38a at a location facing a memory module. The opening 38a is covered by a lid 32. A metal plate 39 is formed to cover inside of the casing 38, and is made ground potential. An electric conductive member is prepared inside of the lid 32, and a part of metal plate 39 is formed as a projection section 39a and contacts to the electric conductive member near the opening 38a. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
