| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive measuring probe having a long lifetime and reliability of measurement accuracy. SOLUTION: In this measuring probe 1 used for a BGA type semiconductor device 6 formed by arranging a plurality of metal balls conductive to a terminal of a semiconductor chip on the bottom surface of a package storing the semiconductor chip inside, a probe element 4 abutting on each metal ball 5 is constituted of a sheet metal having elasticity in the abutting direction on each metal ball 5, and the tip side edge of the probe element 4 made of the sheet metal is allowed to abut on the metal ball 5. COPYRIGHT: (C)2008,JPO&INPIT
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