| 摘要 |
The present invention relates to securing a substrate to an electrostatic chuck to minimise damage to the substrate. In particular, the present invention relates to securing a substrate to an electrostatic chuck provided as part of a substrate scanner in an ion implanter. A method of loading a substrate on an electrostatic chuck of a substrate holder is provided that comprises placing a substrate onto the chuck; supplying a first voltage to an electrode in the chuck thereby causing an electrostatic force due to attraction of the substrate to the chuck; subsequently, but prior to moving the substrate, supplying a second voltage to the electrode greater than the first voltage thereby causing an increased electrostatic force.
|
