| 摘要 |
A heating device 1 includes a flat heating chamber 3 provided with a side opening. A substrate W is carried in a horizontal position through the side opening into the processing chamber 3 , and is subjected to a heating process in the heating chamber 3 . the heating chamber 3 is provided with heating plates 34 and 35 respectively provided with heating elements 34 a and 35 a, and a cooling mechanism 2 for cooling the heating plates 34 and 35 . A controller 7 controls the cooling mechanism such that the heating plates 34 and 35 are cooled after the completion of the heating process for heating the substrate W and before a succeeding substrate W is carried into the heating chamber 3 , and controls the heating elements 34 a and 35 a such that the heating plates 34 and 35 are heated at a processing temperature after the succeeding substrate has been carried into the heating chamber 3.
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