| 摘要 |
A transponder chip module is recessed into the surface of a substrate, end portions of an antenna wire are held in place on terminal areas of the chip module by a patch which may be transparent to allow laser bonding of the wire to the terminal areas. A cover may be disposed over everything. Conductive glue or a solderable material may be used to connect the wire to the terminal areas. A recess for the chip module, and a channel for the antenna wire may be formed by laser ablation. The substrate may be Teslin(TM), PET/PETE or Polycarbonate. The antenna wire may have a diameter of 60 mum. A synthetic cushion material may be provided beneath the transponder chip module. |
