| 摘要 |
A semiconductor device includes plural fuse elements that can be disconnected by irradiating a laser beam, lower-layer wirings that are located lower than the use elements, and plural through-hole electrodes for connecting between the fuse elements and the lower-layer wirings. The through-hole electrodes are provided at both ends of the fuse elements in the longitudinal direction, and a plurality of fuse elements are laid out on substantially a straight line in an A direction as a longitudinal direction. Accordingly, at the time of disconnecting a predetermined fuse element, through-hole electrodes connected to this fuse element become a shade, and unnecessary energy of a laser beam is not directly irradiated to other through-hole electrodes.
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