| 摘要 |
The present invention is directed to a high frequency module used for wireless communication module, and comprises a first organic substrate ( 11 ) in which conductive pattern or patterns are formed on the principal surface thereof and one element body ( 7 ) or more are mounted, and a second organic substrate ( 12 ) in which a recessed portion ( 22 ) is formed in correspondence with the area where the element body or bodies ( 7 ) are mounted at the connecting surface to the first organic substrate ( 11 ). In the state where the second organic substrate ( 12 ) is connected to the first organic substrate ( 11 ), an element body accommodating portion ( 24 ) which seals the element body or bodies ( 7 ) is constituted by the recessed portion ( 22 ), wherein the element body accommodating portion ( 24 ) is adapted so that moisture resistance characteristic and oxidation resistance characteristic are maintained.
|
