发明名称 Mounting structures for integrated circuit modules
摘要 A structure of an integrated circuit module includes a wiring board, a plurality of integrated circuits and at least one terminating resistance circuit. The wiring board has a mounting region on at least one surface thereof. The plurality of integrated circuits are mounted in the mounting region of the wiring board and spaced from one another in a first direction. The at least one terminating resistance circuit is arranged between at least two adjacent integrated circuits, and coupled to an output of a last of the plurality of integrated circuits.
申请公布号 US2008179649(A1) 申请公布日期 2008.07.31
申请号 US20080010138 申请日期 2008.01.22
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK SUNG-JOO;KO KI-HYUN;YUN YOUNG;KIM SOO-KYUNG
分类号 H01L29/94;H01L21/00 主分类号 H01L29/94
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