发明名称 |
Mounting structures for integrated circuit modules |
摘要 |
A structure of an integrated circuit module includes a wiring board, a plurality of integrated circuits and at least one terminating resistance circuit. The wiring board has a mounting region on at least one surface thereof. The plurality of integrated circuits are mounted in the mounting region of the wiring board and spaced from one another in a first direction. The at least one terminating resistance circuit is arranged between at least two adjacent integrated circuits, and coupled to an output of a last of the plurality of integrated circuits.
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申请公布号 |
US2008179649(A1) |
申请公布日期 |
2008.07.31 |
申请号 |
US20080010138 |
申请日期 |
2008.01.22 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK SUNG-JOO;KO KI-HYUN;YUN YOUNG;KIM SOO-KYUNG |
分类号 |
H01L29/94;H01L21/00 |
主分类号 |
H01L29/94 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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