Chip e.g. semiconductor chip, transporting method, involves moving chips into lower releasing position, ejecting chips together with portion of fluid, and dosing or storing chips on substrate or target

摘要

The method involves transferring chips (12) e.g. semiconductor chips, into a transfer device filled with a fluid. The chips are moved into a lower releasing position, and held and subsequently ejected by a pressure wave of the chips via an air-gap between a lower releasing position and a substrate or a target. The chips are ejected together with a portion of the fluid, and dosed or stored on the substrate or the target. The pressure wave is produced by an external pressure generator in connection with a quick dosing valve. An independent claim is also included for a device for transport of chips to a target position.