CHIP LEVEL PACKAGING FOR WIRELESS SURFACE ACOUSTIC WAVE SENSOR

摘要

A sensor packaging system and methodology includes a plastic substrate configured to include a gap for receiving and maintaining an acoustic wave sensor. An antenna can be printed directly on the plastic substrate and connected electrically to the acoustic wave sensor for the transmission and receipt of data from and to the acoustic wave sensor. The antenna can be flip chip mounted to the acoustic wave sensor, which can be implemented, for example, in the context of a Surface Acoustic Wave (SAW) sensor chip. Such a SAW sensor chip can includes a plurality of metal electrodes located on the same surface of the plastic substrate as the SAW sensor chip.