| 摘要 |
<p>A LED includes a first substrate (10) having a recess, a second substrate (40) having a polarity opposing that of the first substrate (10), a LED chip (20) die-bonded on the recess, a bonding wire (30) interconnecting the LED chip (20) and the second substrate (40), and a case (50) formed around the first substrate (10), the second substrate (40), the LED chip (20), and the bonding wire (30); The case (50) includes a curve rough surface on a front portion. The curve rough surface is adapted to diverge light emitted by the LED chip (20) such that light can be transmitted toward a wider area. Either ridges or grooves are formed on the curve rough surface. The curve rough surface is formed by either injection molding in the packaging process of the case (50) or adhering after the injection molding process.</p> |
