MIXED ALLOY LEAD-FREE SOLDER PASTE,申请号EP20030800221-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	MIXED ALLOY LEAD-FREE SOLDER PASTE
摘要
申请公布号	EP1585614(A4)	申请公布日期	2008.07.30
申请号	EP20030800221	申请日期	2003.12.26
申请人	MOTOROLA, INC.	发明人	GOUDARI, VAHID, KAZEM;BRADLEY, EDWIN;FARIELLO, BRIAN
分类号	B23K35/02;B23K35/26;H05K3/34;(IPC1-7):B23K31/02	主分类号	B23K35/02
代理机构		代理人
主权项
地址

您可能感兴趣的专利

NONAQUEOUS ELECTROLYTE SECONDARY BATTERY

INDIVIDUAL IDENTIFYING DEVICE

TONER FOR DEVELOPING ELECTROSTATIC CHARGE IMAGE

REVOLUTION DETECTING DEVICE FOR MAGNETIC TAPE REEL STAND

MAGNETIC SEMICONDUCTOR DEVICE

WOODEN DECORATIVE BOARD AND MANUFACTURE THEREOF

POSITION DETECTING APPARATUS

THERMAL HEAD PROTECTION SYSTEM OF THERMAL PRINTER

EXCAVATOR WITH HOLE OF SMALL CALIBER AND COURSE CORRECTION IN PROPELLING METHOD WITH HOLE OF SMALL CALIBER

DEVICE AND METHOD FOR UNDERGROUND PROPULSION

FORMATION OF DEPOSITED FILM

OPTICALLY-DRIVEN QUANTIZATION DEVICE

HIGH TEMPERATURE BATTERY SYSTEM

RECORDING METHOD FOR PROCESSING PROCEDURE AND USER PROPERTY AND JUDGEMENT METHOD FOR INTERCHANGEABILITY OF PROCESSING PROCEDURE AND USER PROPERTY

双面绢画屏风