| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in sensitivity, plating bath contaminating property, developability and mechanical strength. SOLUTION: In the photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in one molecule and (C) a photopolymerization initiator, a compound of formula I (where each of four symbols R is a 1-6C alkyl and each of four symbols Z is a halogen atom) is contained as an essential component as the component C. |
