| 摘要 |
<p>PROBLEM TO BE SOLVED: To make the flatness of the ball terminal vertex position of a semiconductor package uniform. SOLUTION: A method for regulating the flatness of the ball terminal of the semiconductor package comprises the steps of taking out the object package 1 from a tray stocker 3 conveyed to a taking-out position 5a by a first pickup mechanism 7, moving the package 1 to an image processing inspecting unit 9, and measuring the flatness of the ball terminal vertex position. When the flatness falls within a specified value range, the package is recognized as being good, and returned to the stocker 3. When the flatness is out of the range, the package 1 is contacted with the working surface of a blade 11a, and the ball terminal is ground so that an imaginary flat surface parallel to the one flat surface in which the ball terminals including the vertex of the most protruded ball terminal are arrayed is retracted to the one flat surface side by a predetermined distance. The method further comprises the steps of moving the package 1 to the inspecting unit 9, again measuring the flatness of the ball terminal vertex position, recognizing so that the package 1 is good or not, and then returning the package 1 to the stocker 3.</p> |
