发明名称 FLEXIBLE PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME AND DISPLAY DEVICE HAVING THE SAME
摘要 A flexible printed circuit board, a method for manufacturing the same, and a display device having the same are provided to prevent a defect due to heat by positioning a diode chip in the flexible printed circuit board at a temperature lower than a soldering temperature. A flexible printed circuit board includes a flexible base substrate(150), a first conductive unit(130), a second conductive unit(140), and a diode(100). The first conductive unit is positioned on a first surface of the flexible base substrate. The second conductive unit is positioned on a second surface of the flexible base substrate facing the first surface. The diode is included inside the flexible base substrate and electrically connected between the first and second conductive units. The diode includes a first electrode, a barrier metal layer, a semiconductor layer, and a second electrode. The first electrode is electrically connected to the first conductive unit. The second electrode is electrically connected to the second conductive unit.
申请公布号 KR20080070095(A) 申请公布日期 2008.07.30
申请号 KR20070007687 申请日期 2007.01.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, JOON HYUN;PARK, YOUNG JOO;MYUNG, JAE HOON
分类号 H05K1/18 主分类号 H05K1/18
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