| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for fabricating a semiconductor chip in which a supporting/securing tape does not float with a semiconductor chip stuck thereto when the semiconductor wafer is diced by laser-dicing where a laser is guided by water jet and then the semiconductor chip is picked up. <P>SOLUTION: Under a state where a supporting/securing adhesive tape 14 having a porous basic material film is stuck to a ring frame 12 and a semiconductor wafer is stuck to the supporting/securing adhesive tape, the semiconductor wafer is diced by laser-dicing where a laser 5 is guided by water jet 6. Subsequently, a semiconductor chip 1 fabricated by dicing is picked up with a nonporous adhesive tape 13 stuck to the side of the supporting/securing adhesive tape where the semiconductor wafer is not stuck. <P>COPYRIGHT: (C)2003,JPO</p> |
