| 摘要 |
A junction structure of a flexible substrate includes a flexible substrate (1) provided with junction terminals (2). An opposing substrate (5) is placed opposite to the flexible substrate, and provided with junction terminals (6) corresponding to the junction terminals (2). A thermosetting resin adhesive (8) is interposed between the flexible substrate (1) and opposing substrate (5), and used to join the flexible substrate (1) and opposing substrate (5). A thermal conduction equalizing member (3) is formed in at least one of the flexible substrate (1) and opposing substrate (5), independently of the junction terminals (2) formed in the flexible substrate (1) and the junction terminals (6) formed in the opposing substrate (5), not to make an electrical connection between the flexible substrate (1) and opposing substrate (5).
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