| 摘要 |
<p>The thermal storage material microcapsules of the present invention are thermal storage material microcapsules encapsulating a thermal storage material, and the thermal storage material comprising at least one selected from compounds of the following formulae (I) to (III),
€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒR 1 - X-R 2 €ƒ€ƒ€ƒ€ƒ€ƒ(I)
wherein each of R 1 and R 2 is independently a hydrocarbon group having 6 or more carbon atoms and X is a divalent binding group containing a heteroatom,
€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒR 3 (-Y-R 4 )n€ƒ€ƒ€ƒ€ƒ€ƒ(II)
wherein R 3 is a hydrocarbon group having a valence of n, each of R 4 s is independently a hydrocarbon group having 6 or more carbon atoms and each Y is a divalent binding group containing a heteroatom,
€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒA(-Z-R 5 )m€ƒ€ƒ€ƒ€ƒ€ƒ(III)
wherein A is an atom, atomic group or binding group having a valence of m, each of R 5 s is independently a hydrocarbon group having 6 or more carbon atoms and each Z is a divalent binding group containing a heteroatom or a direct bond, the thermal storage material having an acid value of 8 or less.</p> |
