| 摘要 |
An LED(light emitting diode) package is provided to increase light emitting efficiency by forming a light extraction part in which an n-type semiconductor layer of a vertical light emitting device is made of a cone or other types. An LED chip is prepared in which a light extraction part is formed on one surface of a plurality of semiconductor layers. A transparent substrate(70) is positioned on the LED chip. A color conversion material(80) is positioned on the transparent substrate. The LED chip can include a support layer(10), a first electrode(20) positioned on the support layer, a first semiconductor layer(30) positioned on the first electrode, a light emitting layer(40) positioned on the first semiconductor layer, a second semiconductor layer(50) having a plurality of light extraction parts(52) positioned on the light emitting layer, at least one second electrode(60) positioned on the second semiconductor layer and a second semiconductor layer. The transparent substrate can be positioned on the second semiconductor layer.
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