SEMICONDUCTOR PACKAGE, FABRICATING METHOD THEREOF, AND MOLDING APPARATUS AND MOLDING METHOD FOR FABRICATING THE SAME

摘要

A semiconductor package molding apparatus for fabricating a semiconductor package is provided to avoid wire damage by attaching a separate marking film to a semiconductor package and by performing a marking process on the making film. A half-finished package(40) is fixed by a first mold die(120). A cavity(111) is formed in a second mold die(110) to position the half-finished package in the second mold die, and molding resin(112) for sealing the half-finished package is introduced into the second mold die. A multi film supply unit(130) supplies a multi film(136) to the cavity of the second mold die, including a film supply part(132) and a film collection part(134). The film supply part of a reel type supplies the multi film while rotating. The film collection part of a reel type collects the multi film. The multi film can include a release film(137) in contact with the cavity and a marking film(138) in contact with the molding resin.