发明名称 |
Optical sensor chip package |
摘要 |
The present invention relates to an optical sensor chip package in a cavity of forming frame thereof and has a gap between protection layer and optical sensor chip. The optical sensor chip avoids accepting the pressure from protection layer that damage the reliability between pads and metallic traces when protection layer lay on the forming frame. It improves drawbacks of the glue pass trough the gap between optical sensor chip and pads into the optical sensor area of optical sensor chip. It improves the high process yield and reduces the height of optical sensor chip package to achieve lightly and thinly.
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申请公布号 |
US7405456(B2) |
申请公布日期 |
2008.07.29 |
申请号 |
US20050225077 |
申请日期 |
2005.09.14 |
申请人 |
SIGURD MICROELECTRONICS CORP. |
发明人 |
CHEN PO-HUNG;LO CHIN-CHENG;CHEN MAO-JUNG |
分类号 |
H01L29/40 |
主分类号 |
H01L29/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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