发明名称 Wired circuit board
摘要 A wired circuit board having terminals that can ensure large electrical connection areas while preventing shorting of adjacent terminals, to ensure that the terminals are electrically connected with external terminals through molten metal. An insulating base layer 3 is formed on a supporting board 2 so that insulating concave portions 13 are formed at portions thereof where external connecting terminals 8 are to be formed. A conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4 a, 4 b, 4 c, 4 d, the magnetic head connecting terminals 7, and the external connecting portions 8 are integrally formed, and conductive concave portions 9 are formed in the external connecting terminals 8. Thereafter, an insulating cover layer 10 is formed on the insulating base layer 3 so that the magnetic head connecting terminals 7 and the external connecting terminals 8 are exposed from the insulating cover layer 10. In the suspension board with circuit 1 thus formed, when the external connecting terminals 8 are connected with connecting terminals of a read/write substrate via the solder balls 21, reliable connection therebetween can be ensured.
申请公布号 US7405479(B2) 申请公布日期 2008.07.29
申请号 US20050224108 申请日期 2005.09.13
申请人 NITTO DENKO CORPORATION 发明人 KANAGAWA HITOKI;OHSAWA TETSUYA;OOYABU YASUNARI
分类号 H01L23/48 主分类号 H01L23/48
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