AU-FREE ELECTROCONDUCTIVE PARTICLES AND ANISOTROPIC-ELECTROCONDUCTIVE ADHESIVE USING THE SAME

摘要

A gold-free conductive particle is provided to realize excellent cost efficiency and to ensure excellent connection reliability, oxidation stability and electric conductivity even in the absence of a thin gold layer. A gold-free conductive particle(50) comprises: polymer powder(53) having an elastic modulus of at least 1,000 kgf/mm^2(10% strain) and a recovery ratio of 40-80%; a thin metal layer(54) formed on the surface of the polymer and free from gold(Au); and an anti-oxidative layer(52) formed on the surface of the thin metal layer and capable of electric connection by being partially removed at the portion that is in contact with the counter circuit electrode under heating and pressurization.